The thin wafer market is expected to witness significant growth on account of growing need for ultra-thin semiconductor wafers in the industry. Owing to the advancement in technology, many complications encountered with traditional chip fabrication processes have been overcome. Ultra-thin varieties of semiconductors having a thickness around 40 mm are estimated to fuel the market replacing the traditional semiconductors that have a thickness around 500 mm. Thin wafers are estimated to constitute a significant share of the entire semiconductors market over the next six years. Power devices such as LEDs, IGBTs, and RF devices, which have innovative packaging applications, require temporary bonding. The thin wafer market consists of vendors that satisfy the ever-growing needs of memory disks, consumer electronics, and wireless devices. Thin wafers provide support in minimizing the thickness of bundles for smart phones.
http://www.grandviewresearch.com/industry-analysis/thin-wafer-market
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